Bond Broadcom Corp 3.875% ( US11134LAH24 ) in USD

Issuer Broadcom Corp
Market price refresh price now   110.09 %  ▲ 
Country  United States
ISIN code  US11134LAH24 ( in USD )
Interest rate 3.875% per year ( payment 2 times a year)
Maturity 14/01/2027



Prospectus brochure of the bond Broadcom Corp US11134LAH24 en USD 3.875%, maturity 14/01/2027


Minimal amount 2 000 USD
Total amount 4 798 407 000 USD
Cusip 11134LAH2
Standard & Poor's ( S&P ) rating BBB- ( Lower medium grade - Investment-grade )
Moody's rating Baa3 ( Lower medium grade - Investment-grade )
Next Coupon 15/01/2027 ( In 100 days )
Detailed description Broadcom Inc. is a multinational technology company that designs, develops, and supplies a wide range of semiconductor and infrastructure software products.

Broadcom Corp. issued a USD 4,798,407,000 bond (CUSIP: 11134LAH2, ISIN: US11134LAH24) maturing January 14, 2027, with a 3.875% coupon, paying semi-annually, currently trading at 100%, minimum purchase 2,000, rated BBB- by S&P and Baa3 by Moody's.
DateClean price
07/08/2024100.00%
23/12/202397.39%
11/08/202398.70%
18/07/202398.70%
24/06/202398.70%
31/05/202398.70%
07/05/202398.70%
13/04/202398.70%
20/03/202398.70%
25/02/202398.70%
02/02/202398.70%
10/01/202398.70%
18/12/202298.70%
25/11/202298.70%
02/11/202298.70%
12/10/202298.70%
21/09/202298.70%
31/08/202298.70%
10/08/202298.70%
20/07/202298.70%
29/06/202298.70%
08/06/202298.70%
18/05/202298.70%
27/04/202298.70%
11/04/202299.17%
27/03/2022100.10%
13/03/2022102.01%
26/02/2022103.68%
07/02/2022104.63%
23/01/2022106.20%
03/01/2022108.34%
18/12/2021108.49%
17/12/2021108.49%
01/12/2021107.27%
15/11/2021108.13%
01/11/2021107.97%
18/10/2021108.76%
04/10/2021110.17%
16/09/2021109.93%
31/08/2021110.27%
19/08/2021109.94%
07/08/2021110.36%
26/07/2021110.82%
13/07/2021110.73%
29/06/2021110.27%
15/06/2021110.54%
28/05/2021109.80%
11/05/2021110.09%