Bond Broadcom Corp 3.875% ( US11134LAH24 ) in USD

Issuer Broadcom Corp
Market price refresh price now   100 %  ▲ 
Country  United States
ISIN code  US11134LAH24 ( in USD )
Interest rate 3.875% per year ( payment 2 times a year)
Maturity 01/14/2027



Prospectus brochure of the bond Broadcom Corp US11134LAH24 en USD 3.875%, maturity 01/14/2027




Minimal amount 2 000 USD
Total amount 4 798 407 000 USD
Cusip 11134LAH2
Standard & Poor's ( S&P ) rating BBB- ( Lower medium grade - Investment-grade )
Moody's rating Baa3 ( Lower medium grade - Investment-grade )
Next Coupon 01/15/2027 ( In 61 days )
Detailed description Broadcom Inc. is a multinational technology company that designs, develops, and supplies a wide range of semiconductor and infrastructure software products.

Broadcom Corp. issued a USD 4,798,407,000 bond (CUSIP: 11134LAH2, ISIN: US11134LAH24) maturing January 14, 2027, with a 3.875% coupon, paying semi-annually, currently trading at 100%, minimum purchase 2,000, rated BBB- by S&P and Baa3 by Moody's.
DateClean price
08/07/2024100.00%
12/23/202397.39%
08/11/202398.70%
07/18/202398.70%
06/24/202398.70%
05/31/202398.70%
05/07/202398.70%
04/13/202398.70%
03/20/202398.70%
02/25/202398.70%
02/02/202398.70%
01/10/202398.70%
12/18/202298.70%
11/25/202298.70%
11/02/202298.70%
10/12/202298.70%
09/21/202298.70%
08/31/202298.70%
08/10/202298.70%
07/20/202298.70%
06/29/202298.70%
06/08/202298.70%
05/18/202298.70%
04/27/202298.70%
04/11/202299.17%
03/27/2022100.10%
03/13/2022102.01%
02/26/2022103.68%
02/07/2022104.63%
01/23/2022106.20%
01/03/2022108.34%
12/18/2021108.49%
12/17/2021108.49%
12/01/2021107.27%
11/15/2021108.13%
11/01/2021107.97%
10/18/2021108.76%
10/04/2021110.17%
09/16/2021109.93%
08/31/2021110.27%
08/19/2021109.94%
08/07/2021110.36%
07/26/2021110.82%
07/13/2021110.73%
06/29/2021110.27%
06/15/2021110.54%
05/28/2021109.80%
05/11/2021110.09%