Bond Li & Fung Limited 8.375% ( XS3130021366 ) in USD

Issuer Li & Fung Limited
Market price refresh price now   101.59 %  ▲ 
Country  Hong Kong
ISIN code  XS3130021366 ( in USD )
Interest rate 8.375% per year ( payment 2 times a year)
Maturity 02/04/2029
Minimal amount 200 000 USD
Total amount 300 000 000 USD
Next Coupon 02/05/2027 ( In 103 days )
Detailed description Li & Fung Limited was a Hong Kong-based global sourcing, supply chain management, and logistics company that operated as an intermediary between retailers and manufacturers, facilitating the production and distribution of consumer goods worldwide before its dissolution in 2021.

The Bond issued by Li & Fung Limited ( Hong Kong ) , in USD, with the ISIN code XS3130021366, pays a coupon of 8.375% per year.
The coupons are paid 2 times per year and the Bond maturity is 02/04/2029
DateClean price
07/24/2026101.59%