Bond T-Mobile America 2.4% ( USU88868BA89 ) in USD

Issuer	T-Mobile America
Market price	86.75 % ⇌
Country	United States
ISIN code	USU88868BA89 ( in USD )
Interest rate	2.4% per year ( payment 2 times a year)
Maturity	15/03/2029
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Minimal amount	2 000 USD
Total amount	500 000 000 USD
Cusip	U88868BA8
Standard & Poor's ( S&P ) rating	BBB ( Lower medium grade - Investment-grade )
Moody's rating	N/A
Next Coupon	15/03/2026 ( In 36 days )
Detailed description	T-Mobile US, Inc. is a leading American telecommunications company offering wireless voice, messaging, data, and broadband services across the United States, utilizing a nationwide 4G LTE and 5G network. T-Mobile US issued a USD 500,000,000 bond (CUSIP: U88868BA8, ISIN: USU88868BA89) maturing on March 15, 2029, currently trading at 86.75% of par value, offering a 2.4% coupon rate paid semi-annually, with a minimum purchase size of 2,000 and a Standard & Poor's rating of BBB.