Bond T-Mobile US Inc. 2.25% ( USU88868AP67 ) in USD

Issuer	T-Mobile US Inc.
Market price	100 % ▲
Country	United States
ISIN code	USU88868AP67 ( in USD )
Interest rate	2.25% per year ( payment 2 times a year)
Maturity	15/11/2031
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Minimal amount	2 000 USD
Total amount	1 000 000 000 USD
Cusip	U88868AP6
Standard & Poor's ( S&P ) rating	BBB- ( Lower medium grade - Investment-grade )
Moody's rating	N/A
Next Coupon	15/11/2025 ( In 176 days )
Detailed description	T-Mobile US, Inc. is a major American telecommunications company providing wireless voice, messaging, and data services, along with home internet and other related products and services. The Bond issued by T-Mobile US Inc. ( United States ) , in USD, with the ISIN code USU88868AP67, pays a coupon of 2.25% per year. The coupons are paid 2 times per year and the Bond maturity is 15/11/2031 The Bond issued by T-Mobile US Inc. ( United States ) , in USD, with the ISIN code USU88868AP67, was rated BBB- ( Lower medium grade - Investment-grade ) by Standard & Poor's ( S&P ) credit rating agency.