Bond T-Mobile US Inc. 2.05% ( USU88868AK70 ) in USD

Issuer	T-Mobile US Inc.
Market price	102.269 % ⇌
Country	United States
ISIN code	USU88868AK70 ( in USD )
Interest rate	2.05% per year ( payment 2 times a year)
Maturity	14/02/2028
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Minimal amount	/
Total amount	/
Cusip	U88868AK7
Standard & Poor's ( S&P ) rating	BBB ( Lower medium grade - Investment-grade )
Next Coupon	15/02/2026 ( In 60 days )
Detailed description	T-Mobile US, Inc. is a major American telecommunications company providing wireless voice, messaging, and data services, along with home internet and other related products and services. The Bond issued by T-Mobile US Inc. ( United States ) , in USD, with the ISIN code USU88868AK70, pays a coupon of 2.05% per year. The coupons are paid 2 times per year and the Bond maturity is 14/02/2028 The Bond issued by T-Mobile US Inc. ( United States ) , in USD, with the ISIN code USU88868AK70, was rated BBB ( Lower medium grade - Investment-grade ) by Standard & Poor's ( S&P ) credit rating agency.