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ItalianoBond TTM Tech 4% ( USU8729LAC73 ) in USD
| Issuer | TTM Tech |
| Market price |  90.2609 % ⇌ |
| Country |  United States
|
| ISIN code |
 USU8729LAC73 ( in USD )
|
| Interest rate | 4% per year ( payment 2 times a year) |
| Maturity | 01/03/2029 |
|
Prospectus brochure in PDF format is unavailable at this time We will provide it as soon as possible |
|
| Minimal amount | 2 000 USD |
| Total amount | 500 000 000 USD |
| Cusip | U8729LAC7 |
| Standard & Poor's ( S&P ) rating | BB- ( Non-investment grade speculative ) |
| Next Coupon | 01/03/2026 ( In 22 days ) |
| Detailed description |
TTM Technologies, Inc. is a global provider of electronic manufacturing services (EMS) and engineered solutions, specializing in high-speed and high-frequency printed circuit boards (PCBs), backplanes, and other advanced interconnect solutions for various industries including aerospace & defense, automotive, communications, and medical. TTM Technologies' US$500,000,000 4% bonds (CUSIP: U8729LAC7, ISIN: USU8729LAC73), maturing on 01/03/2029, currently trade at 90.2609% of face value with a minimum trading size of 2000, paying semi-annual interest and rated BB- by Standard & Poor's. |