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ItalianoBond Broadcom Inc 2.25% ( USU1109MAN66 ) in USD
| Issuer | Broadcom Inc | ||||||||
| Market price | 100.00 % ⇌ | ||||||||
| Country |  United States
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| ISIN code |
 USU1109MAN66 ( in USD )
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| Interest rate | 2.25% per year ( payment 2 times a year) | ||||||||
| Maturity | 15/11/2023 - Bond has expired | ||||||||
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Prospectus brochure in PDF format |
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| Minimal amount | 2 000 USD | ||||||||
| Total amount | 1 000 000 000 USD | ||||||||
| Cusip | U1109MAN6 | ||||||||
| Detailed description |
Broadcom Inc. is a leading designer, developer, and global supplier of a broad range of semiconductor and infrastructure software solutions. The Bond issued by Broadcom Inc ( United States ) , in USD, with the ISIN code USU1109MAN66, pays a coupon of 2.25% per year. The coupons are paid 2 times per year and the Bond maturity is 15/11/2023 |
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