Bond Broadcom Inc 4.11% ( USU1109MAH98 ) in USD
| Issuer | Broadcom Inc | ||||||||
| Market price | |||||||||
| Country | United States
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| ISIN code |
USU1109MAH98 ( in USD )
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| Interest rate | 4.11% per year ( payment 2 times a year) | ||||||||
| Maturity | 15/09/2028 | ||||||||
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Prospectus brochure in PDF format |
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| Minimal amount | 2 000 USD | ||||||||
| Total amount | 2 222 349 000 USD | ||||||||
| Cusip | U1109MAH9 | ||||||||
| Standard & Poor's ( S&P ) rating | BBB- ( Lower medium grade - Investment-grade ) | ||||||||
| Moody's rating | N/A | ||||||||
| Next Coupon | 15/09/2026 ( In 5 days ) | ||||||||
| Detailed description |
Broadcom Inc. is a leading designer, developer, and global supplier of a broad range of semiconductor and infrastructure software solutions. The Bond issued by Broadcom Inc ( United States ) , in USD, with the ISIN code USU1109MAH98, pays a coupon of 4.11% per year. The coupons are paid 2 times per year and the Bond maturity is 15/09/2028 The Bond issued by Broadcom Inc ( United States ) , in USD, with the ISIN code USU1109MAH98, was rated BBB- ( Lower medium grade - Investment-grade ) by Standard & Poor's ( S&P ) credit rating agency. |
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