Bond Apex Micro Devices Inc. 7% ( USU00775AF09 ) in USD

Issuer	Apex Micro Devices Inc.
Market price	100 % ▲
Country	United States
ISIN code	USU00775AF09 ( in USD )
Interest rate	7% per year ( payment 2 times a year)
Maturity	30/06/2024 - Bond has expired
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Minimal amount	2 000 USD
Total amount	500 000 000 USD
Cusip	U00775AF0
Standard & Poor's ( S&P ) rating	N/A
Moody's rating	N/A
Detailed description	Advanced Micro Devices, Inc. (AMD) is a multinational semiconductor company that designs and manufactures microprocessors, chipsets, embedded processors, and graphics processing units (GPUs) for servers, personal computers, and other applications. A bond issued by Advanced Micro Devices Inc. (AMD), a leading American multinational semiconductor company renowned for its development of high-performance computing and visualization products including CPUs, GPUs, and related technologies for consumer, professional, and enterprise markets, has recently concluded its financial lifecycle; this specific debt instrument, identified by ISIN USU00775AF09 and CUSIP U00775AF0, originated from the United States with a total issuance size of $500,000,000 USD, featured a 7% interest rate, maintained a market price of 100%, and was available for a minimum purchase of $2,000, with interest payments scheduled twice annually until its maturity date of June 30, 2024, at which point the bond successfully matured and was fully repaid, thereby settling this financial obligation for the issuer.