Bond JPMorgan Chase & Co. 4.15% ( US898384BB74 ) in USD

Issuer	JPMorgan Chase & Co.
Market price	100 % ▲
Country	United States
ISIN code	US898384BB74 ( in USD )
Interest rate	4.15% per year ( payment 2 times a year)
Maturity	01/07/2029
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Minimal amount	1 000 USD
Total amount	/
Cusip	898384BB7
Standard & Poor's ( S&P ) rating	N/A
Moody's rating	N/A
Next Coupon	01/01/2026 ( In 55 days )
Detailed description	JPMorgan Chase & Co. is a leading global financial services firm offering investment banking, consumer and community banking, commercial banking, and asset and wealth management services across numerous countries. JPMorgan Chase Bank issued a USD 4.15% bond (ISIN: US898384BB74, CUSIP: 898384BB7) maturing on July 1, 2029, currently trading at 100% with a minimum purchase size of 1000 units and a semi-annual coupon payment.