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ItalianoBond SoftBank Corp 5.332% ( US83405KAB89 ) in USD
| Issuer | SoftBank Corp | ||||||||
| Market price |  100.10 % ▼ |
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| Country |  Japan
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| ISIN code |
 US83405KAB89 ( in USD )
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| Interest rate | 5.332% per year ( payment 2 times a year) | ||||||||
| Maturity | 08/07/2035 | ||||||||
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Prospectus brochure in PDF format |
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| Minimal amount | / | ||||||||
| Total amount | / | ||||||||
| Cusip | 83405KAB8 | ||||||||
| Standard & Poor's ( S&P ) rating | BBB ( Lower medium grade - Investment-grade ) | ||||||||
| Next Coupon | 09/01/2027 ( In 124 days ) | ||||||||
| Detailed description |
Japanese technology giant providing telecommunications and investment services. The Bond issued by SoftBank Corp ( Japan ) , in USD, with the ISIN code US83405KAB89, pays a coupon of 5.332% per year. The coupons are paid 2 times per year and the Bond maturity is 08/07/2035 The Bond issued by SoftBank Corp ( Japan ) , in USD, with the ISIN code US83405KAB89, was rated BBB ( Lower medium grade - Investment-grade ) by Standard & Poor's ( S&P ) credit rating agency. |
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