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ItalianoBond JPMorgan Chase 2.75% ( US46625HLW87 ) in USD
| Issuer | JPMorgan Chase |
| Market price | 100 % ⇌ |
| Country |  United States
|
| ISIN code |
 US46625HLW87 ( in USD )
|
| Interest rate | 2.75% per year ( payment 2 times a year) |
| Maturity | 23/06/2020 - Bond has expired |
|
Prospectus brochure in PDF format is unavailable at this time We will provide it as soon as possible |
|
| Minimal amount | 2 000 USD |
| Total amount | 2 250 000 000 USD |
| Cusip | 46625HLW8 |
| Detailed description |
JPMorgan Chase & Co. is a leading global financial services firm offering investment banking, asset and wealth management, and consumer and community banking services. JPMorgan's USD 2,250,000,000 2.75% bond (CUSIP: 46625HLW8, ISIN: US46625HLW87), issued in the United States, matured on June 23, 2020, and has been redeemed at 100%. |