Intel Corporation designs and manufactures semiconductor chips, primarily microprocessors and chipsets, for personal computers, data centers, and other devices.
This financial instrument, identified by ISIN US458140BH27 and CUSIP 458140BH2, represents a corporate bond issued by Intel Corporation, a globally recognized leader in the semiconductor industry headquartered in the United States, which holds a dominant position in the design and manufacturing of microprocessors for a wide array of computing devices, playing a pivotal role in the advancement of technology and digital infrastructure worldwide. This particular bond, originating from the United States, is currently trading at par, reflecting a market price of 100%, and is denominated in US Dollars (USD), offering a fixed annual interest rate of 2.45% with interest payments distributed semi-annually, aligning with its stated payment frequency of two times per year. The total size of this issuance stands at $2,000,000,000, with a minimum purchase amount set at $2,000, and it is scheduled to mature on November 14, 2029, benefiting from strong credit assessments from leading rating agencies, holding an A+ rating from Standard & Poor's (S&P) and an A1 rating from Moody's, indicative of its investment-grade quality and the issuer's robust financial standing.
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103.13 % ▲ 
United States
US458140BH27 ( in USD )
