Bond Intel 3.25% ( US458140AF79 ) in USD
| Issuer | Intel | ||||||||||||||||||||||||||||||
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| Country | United States
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| ISIN code |
US458140AF79 ( in USD )
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| Interest rate | 3.25% per year ( payment 2 times a year) | ||||||||||||||||||||||||||||||
| Maturity | 01/08/2039 | ||||||||||||||||||||||||||||||
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Prospectus brochure in PDF format |
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| Minimal amount | 1 000 USD | ||||||||||||||||||||||||||||||
| Total amount | 2 000 000 000 USD | ||||||||||||||||||||||||||||||
| Cusip | 458140AF7 | ||||||||||||||||||||||||||||||
| Next Coupon | 01/02/2027 ( In 158 days ) | ||||||||||||||||||||||||||||||
| Detailed description |
Intel Corporation designs and manufactures semiconductor chips, primarily microprocessors and chipsets, for personal computers, data centers, and other devices. Intel Corporation, a globally recognized leader in semiconductor manufacturing and technology innovation that designs and produces microprocessors for computer systems as well as chipsets, flash memory, and other related devices, headquartered in the United States and playing a pivotal role in the global technology landscape, has issued a bond identified by ISIN US458140AF79 and CUSIP 458140AF7, which is a USD-denominated obligation originating from the United States with a maturity date of August 1, 2039, carrying a fixed annual interest rate of 3.25% paid semi-annually, part of a total issuance size of $2,000,000,000, and available for a minimum purchase of $1,000, currently trading on the market at 286% of its par value. |
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