Bond HP Inc 4.05% ( US428236BX09 ) in USD

Issuer HP Inc
Market price 100.00 %  ▲ 
Country  United States
ISIN code  US428236BX09 ( in USD )
Interest rate 4.05% per year ( payment 2 times a year)
Maturity 14/09/2022 - Bond has expired



Prospectus brochure of the bond HP Inc US428236BX09 in USD 4.05%, expired


Minimal amount 2 000 USD
Total amount 500 000 000 USD
Cusip 428236BX0
Standard & Poor's ( S&P ) rating BBB ( Lower medium grade - Investment-grade )
Moody's rating Baa2 ( Lower medium grade - Investment-grade )
Detailed description HP Inc. is a multinational information technology company that develops and manufactures personal computing devices, printing and 3D printing systems, and related supplies and services.

The Bond issued by HP Inc ( United States ) , in USD, with the ISIN code US428236BX09, pays a coupon of 4.05% per year.
The coupons are paid 2 times per year and the Bond maturity is 14/09/2022

The Bond issued by HP Inc ( United States ) , in USD, with the ISIN code US428236BX09, was rated Baa2 ( Lower medium grade - Investment-grade ) by Moody's credit rating agency.

The Bond issued by HP Inc ( United States ) , in USD, with the ISIN code US428236BX09, was rated BBB ( Lower medium grade - Investment-grade ) by Standard & Poor's ( S&P ) credit rating agency.
DateClean price
07/08/2024100.00%
14/09/202299.92%
13/09/2022100.00%
27/08/2022100.04%
11/08/202299.93%
26/07/2022100.12%
10/07/2022100.21%
24/06/202299.99%
09/06/2022100.45%
26/05/2022100.58%
10/05/2022100.49%
25/04/2022100.52%
10/04/2022100.80%
26/03/2022100.97%
11/03/2022101.06%
25/02/2022101.23%
05/02/2022101.75%
21/01/2022102.05%
01/01/2022102.29%
16/12/2021102.52%
30/11/2021102.74%
14/11/2021102.80%
31/10/2021102.88%
17/10/2021103.20%
03/10/2021103.40%
15/09/2021103.46%
30/08/2021103.57%
18/08/2021103.81%
06/08/2021103.84%
25/07/2021103.97%
13/07/2021104.07%
30/06/2021104.16%
16/06/2021104.37%
29/05/2021104.54%
12/05/2021104.58%
22/04/2021100.00%