Bond HP Inc 4.05% ( US428236BX09 ) in USD

Issuer HP Inc
Market price 100 %  ▲ 
Country  United States
ISIN code  US428236BX09 ( in USD )
Interest rate 4.05% per year ( payment 2 times a year)
Maturity 09/14/2022 - Bond has expired



Prospectus brochure of the bond HP Inc US428236BX09 in USD 4.05%, expired




Minimal amount 2 000 USD
Total amount 500 000 000 USD
Cusip 428236BX0
Standard & Poor's ( S&P ) rating BBB ( Lower medium grade - Investment-grade )
Moody's rating Baa2 ( Lower medium grade - Investment-grade )
Detailed description HP Inc. is a multinational information technology company that develops and manufactures personal computing devices, printing and 3D printing systems, and related supplies and services.

The Bond issued by HP Inc ( United States ) , in USD, with the ISIN code US428236BX09, pays a coupon of 4.05% per year.
The coupons are paid 2 times per year and the Bond maturity is 09/14/2022

The Bond issued by HP Inc ( United States ) , in USD, with the ISIN code US428236BX09, was rated Baa2 ( Lower medium grade - Investment-grade ) by Moody's credit rating agency.

The Bond issued by HP Inc ( United States ) , in USD, with the ISIN code US428236BX09, was rated BBB ( Lower medium grade - Investment-grade ) by Standard & Poor's ( S&P ) credit rating agency.
DateClean price
08/07/2024100.00%
09/14/202299.92%
09/13/2022100.00%
08/27/2022100.04%
08/11/202299.93%
07/26/2022100.12%
07/10/2022100.21%
06/24/202299.99%
06/09/2022100.45%
05/26/2022100.58%
05/10/2022100.49%
04/25/2022100.52%
04/10/2022100.80%
03/26/2022100.97%
03/11/2022101.06%
02/25/2022101.23%
02/05/2022101.75%
01/21/2022102.05%
01/01/2022102.29%
12/16/2021102.52%
11/30/2021102.74%
11/14/2021102.80%
10/31/2021102.88%
10/17/2021103.20%
10/03/2021103.40%
09/15/2021103.46%
08/30/2021103.57%
08/18/2021103.81%
08/06/2021103.84%
07/25/2021103.97%
07/13/2021104.07%
06/30/2021104.16%
06/16/2021104.37%
05/29/2021104.54%
05/12/2021104.58%
04/22/2021100.00%