Bond HP Inc 5.5% ( US40434LAN55 ) in USD
| Issuer | HP Inc | ||||||||||||||
| Market price | |||||||||||||||
| Country | United States
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| ISIN code |
US40434LAN55 ( in USD )
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| Interest rate | 5.5% per year ( payment 2 times a year) | ||||||||||||||
| Maturity | 01/14/2033 | ||||||||||||||
| Minimal amount | / | ||||||||||||||
| Total amount | / | ||||||||||||||
| Cusip | 40434LAN5 | ||||||||||||||
| Next Coupon | 01/15/2027 ( In 81 days ) | ||||||||||||||
| Detailed description |
HP Inc. is a multinational information technology company that develops and manufactures personal computing devices, printing and 3D printing systems, and related supplies and services. The Bond issued by HP Inc ( United States ) , in USD, with the ISIN code US40434LAN55, pays a coupon of 5.5% per year. The coupons are paid 2 times per year and the Bond maturity is 01/14/2033 |
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