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ItalianoBond HP Inc 4.75% ( US40434LAM72 ) in USD
| Issuer | HP Inc | ||||||||
| Market price |  100.551 % ▼ |
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| Country |  United States
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| ISIN code |
 US40434LAM72 ( in USD )
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| Interest rate | 4.75% per year ( payment 2 times a year) | ||||||||
| Maturity | 01/15/2028 | ||||||||
| Minimal amount | / | ||||||||
| Total amount | / | ||||||||
| Cusip | 40434LAM7 | ||||||||
| Standard & Poor's ( S&P ) rating | BBB ( Lower medium grade - Investment-grade ) | ||||||||
| Moody's rating | Baa2 ( Lower medium grade - Investment-grade ) | ||||||||
| Next Coupon | 01/15/2027 ( In 81 days ) | ||||||||
| Detailed description |
HP Inc. is a multinational information technology company that develops and manufactures personal computing devices, printing and 3D printing systems, and related supplies and services. The Bond issued by HP Inc ( United States ) , in USD, with the ISIN code US40434LAM72, pays a coupon of 4.75% per year. The coupons are paid 2 times per year and the Bond maturity is 01/15/2028 The Bond issued by HP Inc ( United States ) , in USD, with the ISIN code US40434LAM72, was rated Baa2 ( Lower medium grade - Investment-grade ) by Moody's credit rating agency. The Bond issued by HP Inc ( United States ) , in USD, with the ISIN code US40434LAM72, was rated BBB ( Lower medium grade - Investment-grade ) by Standard & Poor's ( S&P ) credit rating agency. |
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