Bond HP Inc 2.65% ( US40434LAG05 ) in USD
| Issuer | HP Inc | ||||
| Market price | |||||
| Country | United States
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| ISIN code |
US40434LAG05 ( in USD )
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| Interest rate | 2.65% per year ( payment 2 times a year) | ||||
| Maturity | 17/06/2031 | ||||
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Prospectus brochure in PDF format |
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| Minimal amount | 2 000 USD | ||||
| Total amount | 1 000 000 000 USD | ||||
| Cusip | 40434LAG0 | ||||
| Next Coupon | 17/12/2026 ( In 72 days ) | ||||
| Detailed description |
HP Inc. is a multinational information technology company that develops and manufactures personal computing devices, printing and 3D printing systems, and related supplies and services. The Bond issued by HP Inc ( United States ) , in USD, with the ISIN code US40434LAG05, pays a coupon of 2.65% per year. The coupons are paid 2 times per year and the Bond maturity is 17/06/2031 |
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