Bond HP Inc 2.65% ( US40434LAG05 ) in USD

Issuer HP Inc
Market price refresh price now   85.02 %  ▲ 
Country  United States
ISIN code  US40434LAG05 ( in USD )
Interest rate 2.65% per year ( payment 2 times a year)
Maturity 17/06/2031



Prospectus brochure in PDF format

Minimal amount 2 000 USD
Total amount 1 000 000 000 USD
Cusip 40434LAG0
Next Coupon 17/12/2026 ( In 72 days )
Detailed description HP Inc. is a multinational information technology company that develops and manufactures personal computing devices, printing and 3D printing systems, and related supplies and services.

The Bond issued by HP Inc ( United States ) , in USD, with the ISIN code US40434LAG05, pays a coupon of 2.65% per year.
The coupons are paid 2 times per year and the Bond maturity is 17/06/2031
DateClean price
16/09/202685.02%