Bond Broadcom Inc 2.6% ( US11135FBF71 ) in USD
| Issuer | Broadcom Inc | ||||||||||
| Market price | |||||||||||
| Country | United States
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| ISIN code |
US11135FBF71 ( in USD )
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| Interest rate | 2.6% per year ( payment 2 times a year) | ||||||||||
| Maturity | 02/15/2033 | ||||||||||
| Minimal amount | 1 000 USD | ||||||||||
| Total amount | 1 750 000 000 USD | ||||||||||
| Cusip | 11135FBF7 | ||||||||||
| Standard & Poor's ( S&P ) rating | A- ( Upper medium grade - Investment-grade ) | ||||||||||
| Moody's rating | A3 ( Upper medium grade - Investment-grade ) | ||||||||||
| Next Coupon | 02/15/2027 ( In 93 days ) | ||||||||||
| Detailed description |
Broadcom Inc. is a leading designer, developer, and global supplier of a broad range of semiconductor and infrastructure software solutions. The Bond issued by Broadcom Inc ( United States ) , in USD, with the ISIN code US11135FBF71, pays a coupon of 2.6% per year. The coupons are paid 2 times per year and the Bond maturity is 02/15/2033 The Bond issued by Broadcom Inc ( United States ) , in USD, with the ISIN code US11135FBF71, was rated A3 ( Upper medium grade - Investment-grade ) by Moody's credit rating agency. The Bond issued by Broadcom Inc ( United States ) , in USD, with the ISIN code US11135FBF71, was rated A- ( Upper medium grade - Investment-grade ) by Standard & Poor's ( S&P ) credit rating agency. |
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