|
Broadcom Corp
|
| 100 % ▼ |
 United States
|
 US11134LAM19 ( in USD )
|
|
2.65% per year ( payment 2 times a year) |
| 01/14/2023 - Bond has expired
|
|
| 2 000 USD |
| 1 000 000 000 USD
|
|
11134LAM1
|
|
BBB- ( Lower medium grade - Investment-grade )
|
|
Baa3 ( Lower medium grade - Investment-grade )
|
Broadcom Inc. is a multinational technology company that designs, develops, and supplies a wide range of semiconductor and infrastructure software products.
Broadcom Corp's US$1,000,000,000 2.65% bonds (CUSIP: 11134LAM1, ISIN: US11134LAM19), issued in USD and maturing on January 14, 2023, have reached maturity and been repaid, rated BBB- by S&P and Baa3 by Moody's.
|
| Date | Clean price |
|---|
| 08/07/2024 | 100.00% | | 01/06/2023 | 100.04% | | 12/14/2022 | 100.04% | | 11/21/2022 | 100.04% | | 10/29/2022 | 100.04% | | 10/08/2022 | 100.04% | | 09/17/2022 | 100.04% | | 08/27/2022 | 100.04% | | 08/06/2022 | 100.04% | | 07/16/2022 | 100.04% | | 06/25/2022 | 100.04% | | 06/04/2022 | 100.04% | | 05/14/2022 | 100.04% | | 04/23/2022 | 100.04% | | 04/08/2022 | 99.99% | | 03/24/2022 | 100.26% | | 03/10/2022 | 100.61% | | 02/24/2022 | 100.75% | | 02/05/2022 | 101.17% | | 01/21/2022 | 101.22% | | 01/01/2022 | 101.52% | | 12/16/2021 | 101.55% | | 11/29/2021 | 101.82% | | 11/14/2021 | 101.91% | | 11/01/2021 | 101.95% | | 10/18/2021 | 102.17% | | 10/05/2021 | 102.34% | | 09/18/2021 | 102.57% | | 08/31/2021 | 102.67% | | 08/19/2021 | 102.73% | | 08/07/2021 | 103.02% | | 08/06/2021 | 103.02% | | 07/25/2021 | 103.00% | | 07/12/2021 | 103.14% | | 06/29/2021 | 103.01% | | 06/15/2021 | 103.15% | | 05/28/2021 | 102.98% | | 05/11/2021 | 103.18% |
|
Français
Italiano