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Broadcom Corp
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| 103.18 % ▲ |
 United States
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 US11134LAM19 ( in USD )
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2.65% per year ( payment 2 times a year) |
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14/01/2023 - Bond has expired
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| 2 000 USD |
| 1 000 000 000 USD
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11134LAM1
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BBB- ( Lower medium grade - Investment-grade )
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Baa3 ( Lower medium grade - Investment-grade )
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Broadcom Inc. is a multinational technology company that designs, develops, and supplies a wide range of semiconductor and infrastructure software products.
Broadcom Corp's US$1,000,000,000 2.65% bonds (CUSIP: 11134LAM1, ISIN: US11134LAM19), issued in USD and maturing on January 14, 2023, have reached maturity and been repaid, rated BBB- by S&P and Baa3 by Moody's.
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| Date | Clean price |
|---|
| 07/08/2024 | 100.00% | | 06/01/2023 | 100.04% | | 14/12/2022 | 100.04% | | 21/11/2022 | 100.04% | | 29/10/2022 | 100.04% | | 08/10/2022 | 100.04% | | 17/09/2022 | 100.04% | | 27/08/2022 | 100.04% | | 06/08/2022 | 100.04% | | 16/07/2022 | 100.04% | | 25/06/2022 | 100.04% | | 04/06/2022 | 100.04% | | 14/05/2022 | 100.04% | | 23/04/2022 | 100.04% | | 08/04/2022 | 99.99% | | 24/03/2022 | 100.26% | | 10/03/2022 | 100.61% | | 24/02/2022 | 100.75% | | 05/02/2022 | 101.17% | | 21/01/2022 | 101.22% | | 01/01/2022 | 101.52% | | 16/12/2021 | 101.55% | | 29/11/2021 | 101.82% | | 14/11/2021 | 101.91% | | 01/11/2021 | 101.95% | | 18/10/2021 | 102.17% | | 05/10/2021 | 102.34% | | 18/09/2021 | 102.57% | | 31/08/2021 | 102.67% | | 19/08/2021 | 102.73% | | 07/08/2021 | 103.02% | | 06/08/2021 | 103.02% | | 25/07/2021 | 103.00% | | 12/07/2021 | 103.14% | | 29/06/2021 | 103.01% | | 15/06/2021 | 103.15% | | 28/05/2021 | 102.98% | | 11/05/2021 | 103.18% |
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