Broadcom Inc. is a multinational technology company that designs, develops, and supplies a wide range of semiconductor and infrastructure software products.
An in-depth analysis of a fixed-income instrument, specifically a bond identified by ISIN US11134LAB53 and CUSIP 11134LAB5, reveals its issuance by Broadcom Corp, a prominent American technology company renowned globally for its leadership in designing, developing, and supplying a broad range of semiconductor and infrastructure software solutions. This particular bond, part of a significant capital raise, was denominated in United States Dollars (USD) and offered an annual interest rate of 2.375%, with interest payments distributed semi-annually to investors. The total principal amount of this offering was USD 2,748,899,900, with a minimum investment unit set at USD 2,000. While its market price was observed at 100% at certain points during its lifespan, reflecting trading at par, the instrument reached its scheduled maturity date on January 15, 2020. As of that date, this bond has successfully concluded its term, with the principal amount fully redeemed and all outstanding obligations reimbursed to bondholders, affirming Broadcom Corp's commitment to its financial obligations.
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