Bond Tencent Holdings Bonds 3.1% ( HK0001193066 ) in CNY
| Issuer | Tencent Holdings Bonds | ||||
| Market price | |||||
| Country | China
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| ISIN code |
HK0001193066 ( in CNY )
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| Interest rate | 3.1% per year ( payment 1 time a year) | ||||
| Maturity | 23/09/2055 | ||||
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Prospectus brochure in PDF format |
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| Minimal amount | 10 000 CNY | ||||
| Total amount | 1 000 000 000 CNY | ||||
| Next Coupon | 23/09/2026 ( In 28 days ) | ||||
| Detailed description |
The Bond issued by Tencent Holdings Bonds ( China ) , in CNY, with the ISIN code HK0001193066, pays a coupon of 3.1% per year. The coupons are paid 1 time per year and the Bond maturity is 23/09/2055 |
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