Bond Jiangmen High Technology And Industrial Park Bonds 4.28% ( HK0001101887 ) in CNY
| Issuer | Jiangmen High Technology And Industrial Park Bonds | ||||
| Market price | |||||
| Country | China
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| ISIN code |
HK0001101887 ( in CNY )
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| Interest rate | 4.28% per year ( payment 1 time a year) | ||||
| Maturity | 24/01/2028 | ||||
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Prospectus brochure in PDF format |
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| Minimal amount | 10 000 CNY | ||||
| Total amount | 360 000 000 CNY | ||||
| Next Coupon | 24/01/2027 ( In 151 days ) | ||||
| Detailed description |
The Bond issued by Jiangmen High Technology And Industrial Park Bonds ( China ) , in CNY, with the ISIN code HK0001101887, pays a coupon of 4.28% per year. The coupons are paid 1 time per year and the Bond maturity is 24/01/2028 |
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