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ItalianoBond Wuxi Taihu Techpark Development & Investment Bonds 3.98% ( CND10004GMP1 ) in CNY
| Issuer | Wuxi Taihu Techpark Development & Investment Bonds |
| Market price | 100 % ▲ |
| Country |  China
|
| ISIN code |
 CND10004GMP1 ( in CNY )
|
| Interest rate | 3.98% per year ( payment 1 time a year) |
| Maturity | 19/03/2023 - Bond has expired |
|
Prospectus brochure in PDF format is unavailable at this time We will provide it as soon as possible |
|
| Minimal amount | / |
| Total amount | 220 000 000 CNY |
| Detailed description |
Wuxi Taihu Techpark Investment & Development Bonds are debt securities issued to finance infrastructure and development projects within the Wuxi Taihu National Hi-tech Industrial Development Zone, offering investors a fixed income return linked to the success of the park's development. The Bond issued by Wuxi Taihu Techpark Development & Investment Bonds ( China ) , in CNY, with the ISIN code CND10004GMP1, pays a coupon of 3.98% per year. The coupons are paid 1 time per year and the Bond maturity is 19/03/2023 |