Bond Chengdu Hi-Tech Investment Group Co. Ltd 6.28% ( XS1901318664 ) in USD
Issuer | Chengdu Hi-Tech Investment Group Co. Ltd | ||
Market price | 104.645 % ⇌ | ||
Country | China | ||
ISIN code | XS1901318664 ( in USD ) | ||
Interest rate | 6.28% per year ( payment 2 times a year) | ||
Maturity | 13/11/2021 - Bond has expired | ||
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Minimal amount | 200 000 USD | ||
Total amount | 300 000 000 USD | ||
Detailed description |
The Bond issued by Chengdu Hi-Tech Investment Group Co. Ltd ( China ) , in USD, with the ISIN code XS1901318664, pays a coupon of 6.28% per year. The coupons are paid 2 times per year and the Bond maturity is 13/11/2021 |