Bond JPMorgan Chase & Co. 3.12% ( XS1450910044 ) in CNY

Issuer	JPMorgan Chase & Co.
Market price	100 % ▲
Country	United States
ISIN code	XS1450910044 ( in CNY )
Interest rate	3.12% per year ( payment 1 time a year)
Maturity	08/12/2026
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Next Coupon	08/12/2025 ( In 187 days )
Detailed description	JPMorgan Chase & Co. is a leading global financial services firm offering investment banking, consumer and community banking, commercial banking, and asset and wealth management services across numerous countries. The Bond issued by JPMorgan Chase & Co. ( United States ) , in CNY, with the ISIN code XS1450910044, pays a coupon of 3.12% per year. The coupons are paid 1 time per year and the Bond maturity is 08/12/2026