Bond Hewlett-Packard Inc. 2.65% ( USU44259CA21 ) in USD

Issuer	Hewlett-Packard Inc.
Market price	100 % ▲
Country	United States
ISIN code	USU44259CA21 ( in USD )
Interest rate	2.65% per year ( payment 2 times a year)
Maturity	17/06/2031
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Minimal amount	2 000 USD
Total amount	1 000 000 000 USD
Cusip	U44259CA2
Standard & Poor's ( S&P ) rating	BBB ( Lower medium grade - Investment-grade )
Moody's rating	N/A
Next Coupon	17/12/2025 ( In 106 days )
Detailed description	HP Inc. is a multinational information technology company that develops and manufactures personal computing devices, printing and 3D printing systems, and related supplies and services. This financial article presents a detailed overview of a specific bond issued by HP Inc., a globally recognized technology enterprise at the forefront of personal systems, printing, and 3D solutions, headquartered in the United States; designated with ISIN USU44259CA21 and CUSIP U44259CA2, this U.S.-originated debt instrument carries a coupon rate of 2.65% in USD, features semi-annual interest payments, and matures on June 17, 2031, representing a total issue size of $1,000,000,000 with a minimum purchase requirement of $2,000, and is currently quoted at 100% of its par value, underpinned by an investment-grade 'BBB' rating from Standard & Poor's (S&P).